(solid.state) diffusion is a means (“ein Mittel”) of mass transport within solid materials by stepwise atomic motion
interdiffusion refers to the migration of impurity atoms (2 material conentraions involved); for host atoms, the term is self diffusion i.e. diffusion within a material where all atoms are the same
vacancy and interstitial diffusion:
vacancy d. occurs via the exchange of an atom residing on a normal lattice site with an adjacent vacancy.
interstitial d.: an atom migrates from one interstitial position to an empty adjacent one
(b) Indicate for which type diffusion occurs more rapidly, and then explain why this is so.
interstitial atomic species generally diffuse more rapidly
vacancy d. depends on the number of vacancies and activation energy to exchange which is rather large
Although, the main reason is that interstitial atoms (e.g. H, C, N, O) are much smaller and thus more mobile.
the rate of mass transport = diffusion flux J is defined as:
J = M/(A*t)
A…cross-sectional area
M…Mass (or number of atoms)
t…elapsed diffusion time
J = [kg/m²s] or [#atoms/m²s]
concentration profile is represented as a plot of concentration versus distance into the solid material
concentration gradient dC/dx is the slope of the concentration profile curve at some specific point
for steady-state d. the diffusion flux J is independent of time
For non-steady state d., there is a net accumulation or depletion of diffusing species, and the flux is dependent on time.
Fick´s First Law:
J = -D * dC/dx
D…diffusion coefficient (constant of proportionality) [m²/s]
concentration gradient is calculated by:
dC/dx = (CA-CB)/(xA-xB)
xA-xB = t = sheet thickness
the driving force for steady-state diffusion is the concentration gradient dC/dx
concentration C is dependent on time and position x -> PDE
diffusion coefficient is assumed to be constant
assumptions made in the solution:
Initial condition: for t = 0, C = C0 at <= x <= inf
Boundary conditions: for t > 0, C = Cs (the const. surface concentration) at x = 0
for t > 0, C = C0 at x = inf
this yields the equation as depicted below, whereby C(x,t) represents the concentration at depth x after time t.
Also note the relation x^2/(D*t) = const. (7.6b in the book)
the magnitude of the diffusion coefficient is an indicator of the rate of atomic motion and depends on both host and diffusing species as well as on temperature
D0 is a temperature dependent pre-exponential
Qd = activation energy for diffusion [J/mol or eV/atom]
Side remark:
For diffusion situations wherein time and temperature are variables and in which composition i.e. C(x) remains constant at some value x 7.6b takes the form:
D*t = const.
Although aluminium has a lower electrical conductivity than Ag, Cu, and Au, its extremely low diffusion coefficient D makes it the material of choice. Often the IC chips, need a further heat treatment (up to 500°C) after the interconnects have been deposited. Significant diffusion of the interconnect metal into the Si can occur, which can destroy the electrical functionality of the IC. -> use Aluminium