Hardware can be categorized as:
input and output devices external and internal memory and the CPU
MOTHERBOARD
Def
A circuit board inside the microcomputers plastic case which serves as single platform to connect all parts of the computer together
MOTHERBOARD
Components
CPU chip, Memory chip(ROM and RAM), I/O interface, Expansion slots, Other logic circuits
MOTHERBOARD
what is an expansion slot?
Connectors on the motherboard where expansion cards like display card can be connected
MOTHERBOARD
2 types of cooling systems
2. Passive- no power eg reducing operating speed of a certain component
MOTHERBOARD
What is CMOS?
Complementary Metal-Oxide Semiconductor battery
Stores setting configurations( eg for date and time in BIOS setting)
POWER SUPPLY
Function?
Converts AC from outlet into DC
POWER SUPPLY
UPS Function?
Uninterrupted Power Supply keeps Computer running for a few minutes after power goes out
POWER SUPPLY
Cooling System?
Has a fan that pulls out hot air and also circulates air throughout the entire system
CARDS
def?
Expansion device that provides certain added capabilities
CARDS
Eg?
PORTS
Def?
Components used as pathways for flow of data
PORTS
eg?
CPU
function?
Accepts instructions and data and executes them storing the result in the memory
CPU
Metric?
Gigahertz(GHz)-Billion instructions/sec
Megahertz(MHz)-Million instructions/sec
CPU
Components?
CPU
What is the function of ALU?
2. Logical comparisons eg of conditions:=>,== etc
CPU
Function of Control Unit?
CPU
Outline the Machine Cycle for the Control Unit
CPU
Def and types of registers?
special, high purpose holding areas for both data and instructions
types- instructions registers
data registers-both data and results
Why do new computers produce more heat?
faster
Why do newer computers require more ventilation?
They compute more and produce more heat
Dangers of overheating in computers?
Reduces Battery life
Damages internal components especially the CPU
Can cause circuits and components to
become unstable
Explain the use of
aluminum and the thermal paste in the cooling structure
Thermal compound is used to maximize the contact surface area by filling in the microscopic gaps. Thermal compound acts as a cooling agent